Intel’s upcoming Lunar Lake MX laptop CPUs use TSMC’s 3nm process and have up to 32GB of onboard RAM. Popular leaker YuuKi-AnS reported this. The CPU series is currently planned for 2025.
The Lunar Lake MX series is intended for low-power laptops, with a TDP ranging from 8W to 30W. The CPU has eight cores, four powerful cores and four economical cores. The SoC is also rumored to feature 16GB to 32GB of dual-channel Lpddr5x-8533 memory, meaning no additional memory modules are needed. YuuKi-AnS claims as much in tweets that have since been deleted Taken by an AnandTech forum user.
According to the leaker, the SoC will feature GPU cores from Intel’s Battlemage series, the successor to the current Arc Alchemist series. The Lunar Lake MX series will consist of seven to eight Xe2 cores with support for real-time ray tracing. Therefore, the SoC supports DisplayPort 2.1 and HDMI 2.1. The SoC should also support Wi-Fi 7 and Bluetooth 5.4, and have a 4th generation NPU.
What’s striking about the chipset is that the part of the processor containing the CPU core is made using TSMC’s N3B-3nm process. This will be the first time. With the next generation, Meteor Lake, the CPU part is still made using a proprietary process, and only secondary tiles such as the IGPU are available from TSMC. Intel previously said that Lunar Lake SoCs will be manufactured in part using its 18A process. Based on this new information, this may at most relate to secondary tiles.