Pictures of a prototype from Intel Canon LLC have emerged. This CPU features an MCM design with three chipsets in one package. This is different from the Cannon Lake launch versions, which had two deaths.

Related to a Cannon Lake-Y generation Core M3 CPU prototype, Hardware collector YuuKi_AnS writes on Twitter. The picture shows a geometric board From Intel, it offers a processor with three small chips packed in a bga package. There is red glue on the CPU that indicates its presence thermocouples It is connected to the processor. Thus, the CPU could have been used as a tdp sample for heat and power tests, a Twitter user speculates.

Cannon Lake was the first CPU to use Intel’s infamous 10nm process. The chips were intended for use in laptops and NUC systems and featured two chips. One of them contained two CPU cores. The other one works as a separate I/O template. So this prototype has a third chip. according to SkyJuice60 by AngstroNomics And the VideoCardz leaked data sheets became that who – which used as mcivr, i.e. Integrated multi-chip voltage regulator. These IVRs control the power supply to the CPU.

Traditionally, such a voltage regulator was on the motherboard, but Intel Combined with his Haswell architecture In the CPU itself. However, a generation later, with Broadwell, IVR was dropped from “mainstream” Intel desktop processors. It is not known why the company did this, but it is believed that it was due to heat issues and restrictions on the surface of the mold. He also writes Tom’s Hardware. So it appears that Intel has plans to use ivr in a separate chip, although chips with this implementation have not appeared on the market. In the end, only two Cannon Lake CPUs appeared on the market. Intel discontinued support for Cannon Lake less than two years after its release.