MediaTek has unveiled the Dimensity 7300 and 7300X sockets for smartphones and foldable devices respectively. The chips are manufactured using a 4nm process, which makes the CPU cores up to a quarter more efficient. No smartphones have been announced yet that will receive Socs.

The Dimensity 7300 and 7300X are largely identical, with four Arm Cortex A78 performance cores and four power-efficient A55 cores. Compared to the 6nm Dimensity 7050, the same performance cores of the new mid-range chips use up to 25 percent less power. The Mali-G615 GPU is also said to be up to 20 percent more power efficient, but MediaTek says In the press release Not with the SoC to which the 7300 series is being compared in this case.

Moreover, the SoCs support maximum 12-bit HDR images with up to 200MP camera. Compared to the Dimensity 7050, the chip is said to be able to autofocus up to 30 percent faster and re-enhance images up to 50 percent faster. According to the brand, the MediaTek APU 655 is twice as fast in performing AI tasks. The chips support displays of up to 2880 x 1200 pixels.

According to MediaTek, the only difference between the Dimensity 7300 and Dimensity 7300X is that the latter SoC is optimized to support two displays. Therefore, it will be intended for manufacturers of foldable devices with two screens. The company did not explain how this was done. The first smartphone with the 7300X is expected to be the Motorola Razr 50. This device will reportedly be announced in June.