SK Hynix has completed development of the first HBM3 memory modules. This memory will provide a bandwidth of up to 819 GB/s per unit. This is an improvement over HBM2E, which has a maximum bandwidth of 460 GB/s.
SK Hynix reported They will provide HBM3 modules in two different capacities. The company comes with modules of 24 GB and 16 GB, which respectively consist of “clusters” of twelve and eight 16 Gigabit layers. These layers are related to tsv’s It used a 1024-bit memory bus. The modules will also support a bandwidth of 6.4 Gbit/s per pin, he writes Anandtic. According to the manufacturer, this equates to a maximum bandwidth of about 819 GB/s per unit. HBM3 also gets on death etc.Manufacturer reports.
In its press release, SK Hynix claims to be the first company to complete the development of HBM3 memory technology. Remarkably, the Jedec standardization organization itself has not yet provided the HBM3 specification. It is not yet known when the first products containing HBM3 will appear on the market. Micron hinted last year that it was working on HBMnext, which could refer to HBM3. That memory should appear at the end of 2022.
|SK Hynix HBM3
|SK Hynix HBM2E
|SK Hynix HBM2
|24 GB out of 16 GB
|bandwidth per pin
|Total bandwidth per stack
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